The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop increasingly smaller electronic components. Today, designers of compact electronic systems are faced with board space constraints, thus driving the requirement for alternative packaging technologies. Functional integration and miniaturization is the key to success!
To aid this miniaturization campaign, a new generation of Chip Diodes from Bourns has emerged that offers the capability to provide a silicon diode with minimal packaging overhead. The small signal diodes are lead-free with Cu/Ni/Au plated terminations and are compatible with lead-free manufacturing processes, conforming many industry and government regulations on lead-free components.
Bourns offers MITE Schottky Barrier Diodes for rectification applications in compact chip package DO-216AA size format. The Model CD216A-B1 Schottky Rectifier Diode Series offer a forward current of 1 A with a choice of repetitive peak reverse voltage of 20 V up to 40 V.
Bourns® Chip Diodes conform to JEDEC standards, are easy to handle with standard pick and place equipment and their flat configuration minimizes roll away.
The Chip Diode product range provides distinct advantages over some of our competitors, such as:
- Package Size: The Chip Diodes are leadless, allowing designers to make real estate savings on PCB layouts. Chip Diodes offer a lower profile and provide height savings over competing SOD80 (MiniMELF) product.
- Environmental: All small signal diode terminations are lead-free with termination Cu/Ni/Au plating. Units meet many worldwide industry and government regulations on lead-free components.
- Manufacturing Friendly: Chip Diodes allow the use of industry standard pick & place equipment. The Chip Diode package makes it easy to handle and their flat configuration minimizes roll away during production operations.
In order to obtain a Bourns® Design Kit please contact your local Bourns sales office or authorized Bourns distributor.