Microelectronic Modules

Bourns demonstrated expertise in technology integration, assembly processes, packaging technology and product launch control results in faster time to market. Knowledgeable Bourns engineers provide a valuable, cost-effective resource across multiple environments and a broad range of applications that ensure enhanced functionality and compatibility from the design stage through manufacturing.

Bourns’ Packaging Solutions

Whether it’s a quick-turn prototype or high-volume manufacturing design, Bourns delivers:

Design compatibility
Miniaturization
RF performance
Precision assembly
High reliability
Cost-effective design
Thermal management
Environmental protection

Core Benefits

Seamless transfer from product design and prototype to volume production
Design For Manufacturability and Design For Testability guidance during new product development
In-house thick film hybrid manufacture and assembly
Experienced packaging that meets harsh electrical and mechanical environments