Services

Proven Reliability

• Dependable performance
• Superior product quality
• Proven in critical applications

Breakthrough Technologies

• Innovative products
• Advanced semiconductor expertise
• R&D focus

 

Bourns' demonstrated expertise in technology integration, assembly processes, precision insert and metal molding, packaging technology and product launch control results in faster time to market. Knowledgeable Bourns engineers provide a valuable, cost-effective resource across multiple environments and a broad range of applications that ensure enhanced functionality and compatibility from the design stage through manufacturing.

Bourns Precision Solutions

Bourns’ operation in Japan, specializes in custom production of precision electro-mechanical and opto-mechanical components.

• Complete solution provider from design to cost support, toolmaking and final product mass production
• World class precision tool shops with 24/7 operation
• Wide range of precision tooling capability:
  • Injection molds
  • Insert molds
  • Sliding core molds
  • Stamping dies
• Precision production control, e.g. molded components with ±20 µm flatness
• Production in global locations to support logistics and cost requirements
• Highly automated production, assembly and inspection for meticulous quality and cost control
• Global customer support/SAP ERP System

Learn more ►

Core Benefits

• Seamless transfer from product design and prototype to volume production
• Design For Manufacturability and Design For Testability guidance during new product development
• In-house advanced packaging manufacturing capability and assembly
• Experienced packaging that meets harsh electrical and mechanical environments

 

Collaboration and Services

• Uncompromising integrity
• Strong partnerships
• Value-added solutions

Global Support Network

• Comprehensive local support
• Global manufacturing
• Fast-turnaround services

 

Bourns’ Packaging Solutions

Whether it’s a quick-turn prototype or high-volume manufacturing design, Bourns delivers:

• Design compatibility
• Miniaturization
• RF performance
• Precision assembly
• High reliability
• Cost-effective design
• Thermal management
• Environmental protection
• High-precision wafer processing and packaging configuration (e.g., wafer preconditioning)
• Fully automated high-speed die attachment and placement (at sub-10 micron accuracy)
• Sophisticated, comprehensive, and versatile wire-bonding capabilities (Au ball, Al wedge, RF-Au wedge, ribbon, Copper, etc.)
• Complete System-in-Package (SiP) solutions equipped with mixed assembly capabilities (e.g., Multi-chip packaging)
• High-precision plastic over-molding, chip encapsulation, multiple-layer material dispensing, dam-and-fill processes, etc.
• Complex multi-die segmentation builds with open-cavity packaging capabilities (housed in Class 1,000 & 10,000 Cleanrooms)
• Materials-centric advanced IC and multi-chip packaging expertise and process development know-how
• ISO/TS 16949:2009 Certified (China and Mexico)
• ISO 14001:2004 Certified (China and Mexico)
• ISO 9001:2008 Certified (China and Mexico)
• ITAR Registered (Mexico)