Bourns’ Packaging Solutions
Whether it’s a quick-turn prototype or high-volume manufacturing design, Bourns delivers:
- Design compatibility
- Miniaturization
- RF performance
- Precision assembly
- High reliability
- Cost-effective design
- Thermal management
- Environmental protection
- High-precision wafer processing and packaging configuration (e.g., wafer preconditioning)
- Fully automated high-speed die attachment and placement (at sub-10 micron accuracy)
- Sophisticated, comprehensive, and versatile wire-bonding capabilities (Au ball, Al wedge, RF-Au wedge, ribbon, Copper, etc.)
- Complete System-in-Package (SiP) solutions equipped with mixed assembly capabilities (e.g., Multi-chip packaging)
- High-precision plastic over-molding, chip encapsulation, multiple-layer material dispensing, dam-and-fill processes, etc.
- Complex multi-die segmentation builds with open-cavity packaging capabilities (housed in Class 1,000 & 10,000 Cleanrooms)
- Materials-centric advanced IC and multi-chip packaging expertise and process development know-how
- ISO/TS 16949:2009 Certified (China and Mexico)
- ISO 14001:2004 Certified (China and Mexico)
- ISO 9001:2008 Certified (China and Mexico)
- ITAR Registered (Mexico)