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Design Files

We offer SPICE, LTspice, S-parameter and 3D files on many of our parts. In addition, we offer Inductor Equivalent Circuits. Please select a product line for a list of Bourns® models that have design files available. If you do not see what you need, please contact a Bourns representative for more information. File types: SPICE/LTspice (DOC, TXT, LIB), 3D (IGS, STP), S-parameter (S2P), Inductor Equivalent Circuits (XLSX). Please note: 1) These files may not be directly compatible with all types of available simulation software and please verify all designs in circuit. 2) Specific information regarding the use of the model may be included within the file. 3) 3D files have been created using typical dimensions unless otherwise noted.

Note on Inductors: SPICE models (unless otherwise specified) are based only on steady-state low-signal AC measurements and analysis based on S-parameter (.s2p file) data collected for each device. Transient analyses or DC bias cannot be done using this data. Please also refer to Instruction for Using Bourns Library Data File on LTspice for general information and these instructions for GDT components.

Products
Model Description
CAT10 Chip Resistor Array
CAT16LV2F6 Concave Chip Array
CAT16LV4F12 Concave Chip Array
CAT16PC2F6 Concave Chip Array
CAT16PC4F12 Concave Chip Array
CAT16PC5F12 Concave Chip Array
CAT16PT2F2 Concave Chip Array
CAT16PT4F4 Concave Chip Array
CAT25 Thick Film Chip Resistor Arrays
CATCAY Chip Resistor Array
CAY10 Chip Resistor Array
CAY17 Bussed Resistor Array