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At electronica India 2025, Bourns to Feature New Component Introductions, GaN-based Power Solutions and Demonstrate Highly-Effective Overtemperature Protection Solution

The capabilities of Bourns’ new India Design Centre will also be unveiled

TAIPEI, Taiwan, September 5, 2025 - Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection and sensing solutions, will feature the Company’s innovative product introductions, demonstrate an advanced, compact overtemperature protection solution and unveil its new India Design Centre at electronica India 2025, September 17 - 19. Bourns is a known leader in the development of standard and custom magnetics, circuit protection and sensing components, offering a range of solutions that meet increasingly complex design specifications that add functionality, efficiency, safety and reliability to electronics designs.

Bourns booth highlights include:

  • State-of-the-art Design Centre in Bengaluru — a hub dedicated to design support enabling faster, more reliable solutions
    • Customer access to an innovation-driven environment for collaborative application and reference design expertise
  • New Products –
    • POWrFuse™ High-Power Fuses designed for photovoltaic, energy storage, battery systems, and other power management systems
    • Thick Film on Steel (TFOS) for demanding applications
    • Ultra-compact GDT21 Series for powerful surge protection
    • SinglFuse™ High Voltage Brick Fuse SMD Fuse Family
  • High heat tolerant Riedon™ power film resistors
  • Grid-level bidirectional PFC and GaN microinverter energy storage system solution
    • Features Texas Instruments reference design board
    • Mini-breaker overtemperature protection demonstration shows improved heat dissipation and protection reset after abnormal overheating

You are invited to meet with Bourns’ component and application experts to see first-hand the Company’s latest products and purpose-built solutions that have been designed to add value while meeting essential next-generation application requirements. Please contact Josephine Chen to arrange an appointment: Josephine.chen@bourns.com

Date: September 17–19, 2025
Location: Bengaluru International Exhibition Centre
Bourns booth: Hall 5, A15

About Bourns

Bourns, Inc., is a leading manufacturer and supplier of position and speed sensors, circuit protection solutions, magnetic components, microelectronic modules, panel controls and resistive products. Headquartered in Riverside, California, USA, Bourns serves a broad range of markets, including automotive, industrial, consumer, communications, non-critical life support medical (low/medium risk), audio and various other market segments. Additional company and product information is available at www.bourns.com.

Bourns® and the Bourns logo are registered trademarks of Bourns, Inc. and may be used only with the permission of Bourns and proper acknowledgement. Other listed names and brands are trademarks or registered trademarks of their respective owners.

Bourns® products have not been designed for and are not intended for use in "lifesaving," "life-critical" or "life-sustaining" applications nor any other applications where failure or malfunction of the Bourns® product may result in personal injury or death. See Legal Disclaimer Notice www.bourns.com/docs/legal/disclaimer.pdf

Agency Contact:
Annette Keller
Keller Communication
annettekeller1984@gmail.com
Company Contact:
David Scofield
Bourns, Inc.
(951) 781-5054
david.scofield@bourns.com