Bourns Introduces Thermal Jumper Chip Series that Provides an Excellent Thermal Dissipation Solution in a Compact Form Factor

Bourns® BTJ Series Thermal
Jumper Chips (Click to enlarge)

The high thermal conductivity and insulating properties of Bourns® BTJ Series Thermal Jumpers help protect and prolong system component lifespan

RIVERSIDE, Calif., December 18, 2025 - Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, today introduced its BTJ Series Thermal Jumper Chips designed to provide effective thermal dissipation in a compact form factor.. These unique devices provide high thermal conductivity while also having insulating properties to help protect and prolong system component lifespans. Because the thermal jumper chips are able to quickly dissipate heat and do not conduct electricity, they have no impact on system operation.

Available in SMD packaging, Bourns® new Thermal Jumper Chips provide an excellent thermal dissipation solution for a variety of mobile devices and electronic equipment that include power supplies, converters and RF and GaN amplifiers.. Furthermore, the advanced design takes advantage of the chips' insulating properties so the space between the heating element and the heat detection element can be filled to enable highly accurate heat detection. These features also help reduce the temperature rise of key components contributing to improved reliability at the system level.

The Bourns® BTJ Series Thermal Jumper Chips are available now and are RoHS* compliant and halogen free**. For additional product information, please see: bourns.com/products/thermal-solutions/thermal-dissipation-devices.

*RoHS Directive 2015/863, Mar 31, 2015 and Annex.

**Bourns considers a product to be "halogen free" if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less.