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ダイオードアレイ

TVS Diode Arrays
技術仕様
概要

携帯デバイスによる通信、コンピュータ、およびビデオ機器の市場によって、半導体産業は、ますます小型化する電子部品を開発することを要求されています。今日、小型電子システムの設計者は、基板面積の制約に悩まされており、代替パッケージング技術の必要性が高まっています。機能の統合と小型化が成功の鍵なのです!

この小型化の動きを支援するために、最小限のパッケージング費用でシリコンダイオードを備える機能をもたらす新世代チップダイオードが Bourns から登場しました。小信号の 0603、1005 および 1206 チップダイオードは、無鉛で銅/ニッケル/金メッキの端子を持ち、もう一方のパッケージ(SMA、SMB、SMC、1408、1607、2010、2419、8L NSOIC、16L NSOIC、SOT23、SOT23-6、16L WSOIC)では、100 %錫の端子です。すべての Bourns® ダイオードは、無鉛の製造プロセスに適合しており、無鉛部品に関する多くの工業および政府規制に準拠しています。

Bourns® チップダイオードは JEDEC 規格に準拠しており、標準的なピック&プレース装置での取り扱いが容易であり、その平らな形状によって紛失の可能性を最小限に抑えます。

利点

チップダイオード製品構成には、以下に示す、競合企業数社を上回る明らかな利点があります。

  • パッケージサイズ:チップダイオード 0603、1005、1206、1408、2010 は、無鉛であることから、設計者は、PCB のレイアウトで基板面積を節約することが可能です。
  • 環境対応:すべての Bourns® ダイオードは RoHS に準拠しており、ユニットは無鉛に関する世界中の多くの工業および政府規制に準拠しています。
  • 製造フレンドリー:チップダイオードにより、業界標準のピック&プレイス装置を使用することが可能になります。チップダイオードパッケージによって取り扱いが容易になるほか、平らな形態であるため生産中の紛失の可能性を最小限に抑えます。

ダイオードの紛争鉱物報告書CFSI_CMRT4-01

デザインノート
RS-485 ポート保護評価ボード 1
RS-485 ポート保護評価ボード 2

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  Specifications

  Design Files

Diode (Line) Capacitance – Cd (pF) min
0.18
max
500
Working Reverse Voltage - VRWM (V) min
2.5
max
70
Clamp Voltage (V) min
1.5
max
100
Max Pulse Current @8/20μs - IPP(A) min
1.2
max
95
 Not Specified Check the "Not Specified" box to include products that do not have this particular parameter specified.
Number of Protected Lines
Function
Package
Bi/Uni Directional
AEC-Q101 Compliance
モデル/データシート 写真 MSL はんだ付けプロファイル 梱包ラベル 端子 適合証明書 サードパーティテストレポート MDS 中国版 RoHS
CD143A-SR05 ~ 12sot143c_part1SMD (Semiconductor Packages)
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CD143A
CD143A-SR05LCsot143c_part3SMD (Semiconductor Packages)
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CD143A-SR05LC
CD143A-SR2.8 ~ 3.3sot143c_part3SMD (Semiconductor Packages)
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CD143A-SR2.8
CD143A-SR3.3
CD143A-SR70sot143c_part1SMD (Semiconductor Packages)
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CD143A
CDDFN6-0504PCDDFN6-0504P_part1SMD (Semiconductor Packages)
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CDDFN6-0504P
CDDFN10-0524PCDDFN10-0524P_part1SMD (Semiconductor Packages)
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DFN-10 Package
CDDFN10-0506NCDDFN10-3304N_part1SMD (Semiconductor Packages)
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CDDFN10
CDDFN10-3324PCDDFN10-0524P_part3SMD (Semiconductor Packages)
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CDDFN10-3324P
CDMSP10-0504MCDMSP10-0504M_part1SMD (Semiconductor Packages)
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CDMSP10-0504M
CDNBS08-PLC03-6cdnbS08_plc03_6_part1SMD (Semiconductor Packages)
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CDNBS08
CDNBS08-SLVU2.8-4cdnbS08_plc03_6_part1SMD (Semiconductor Packages)
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CDNBS08
CDNBS08-SLVU2.8-8cdnbS08_plc03_6_part1SMD (Semiconductor Packages)
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CDNBS08
CDNBS08-SRDA SeriescdnbS08_plc03_6_part1SMD (Semiconductor Packages)
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CDNBS08
CDNBS08-SRDA12-4cdnbS08_plc03_6_part1SMD (Semiconductor Packages)
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CDNBS08
CDNBS08-SRDA15-4cdnbS08_plc03_6_part1SMD (Semiconductor Packages)
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CDNBS08
CDNBS08-SRDA3.3-4cdnbS08_plc03_6_part1SMD (Semiconductor Packages)
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CDNBS08
CDNBS08-T SeriescdnbS08_plc03_6_part1SMD (Semiconductor Packages)
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CDNBS08
CDNBS08-T58CCCDNBS08-T58CC_part1SMD (Semiconductor Packages)
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CDNBS08
CDNBS16-T Series2nbs16j_part1SMD (Semiconductor Packages)
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CDNBS16
CDSOT236-TxxC Seriescdsot23_part3SMD (Semiconductor Packages)
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e3CD 1
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CDSOT236
CDSOT23-SM712cdsot23_t_part1SMD (Semiconductor Packages)
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e3CD 1
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CDSOT23-SM712 (A)
CDSOT23 (C)
CDSOT23-SR208cdsot23_part1SMD (Semiconductor Packages)
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e4CD 1
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CDSOT23-SR208
CDSOT23-SRV05-4cdsot23_part1SMD (Semiconductor Packages)
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e4CD 1
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CDSOT23-SRV05-4
CDSOT23-TxxC Seriescdsot23_t_part1SMD (Semiconductor Packages)
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CDSOT23-TxxC (A)
CDSOT23 (C)
CDSOT23-TxxLC Seriescdsot23_t_part1SMD (Semiconductor Packages)
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e3CD 1
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CDSOT23-TxxLC (A)
CDSOT23 (C)
CDSC706-0504Ccdsot23_part3SMD (Semiconductor Packages)
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e4CD 1
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CDSC706-0504C
CDSOT23-T24CANcdsot23_t_part1SMD (Semiconductor Packages)
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CDSOT23-T24CAN (A)
CDSOT23 (C)
CDSOT236-0502cdsot23_partSMD (Semiconductor Packages)
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CD 1
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CDSOT236-0502
CDSOT236-0504Ccdsot23_partSMD (Semiconductor Packages)
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CDSOT236-0504C
CDSOT236-0504LCcdsot23_partSMD (Semiconductor Packages)
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CD 1
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CDSOT236-0504LC
CDSOT23-0502Bcdsot23_t_partSMD (Semiconductor Packages)
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CD 1
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CDSOT23
CDSOT23-0502Ucdsot23_t_partSMD (Semiconductor Packages)
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CD 1
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CDSOT23
CDSOT353-T05CDSC706-0504C_partSMD (Semiconductor Packages)
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CD 1
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CDSOT353-T05_MDS
CDSOT563-0502CDSC706-0504C_partSMD (Semiconductor Packages)
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CD 1
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CDSOT563-0502
CDDFN10-0516PCDDFN10-0516P_part1SMD (Semiconductor Packages)
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e3CD 1
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CDDFN10-0516P MDS
CDSOT23-SLVU2.8cdsot23_t_part_nr1SMD (Semiconductor Packages)
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e3CD 1
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CDSOT23
CDNBS08-SMDA05-6 SeriescdnbS08_plc03_6_part1SMD (Semiconductor Packages)
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CDNBS08
CDDFN10-2574NCDDFN10-2574N_part1SMD (Semiconductor Packages)
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e4CD 1
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CDDFN10-2574N
CDSOT23-T24CAN-QCDSOT23-T24CAN-Q_part1SMD (Semiconductor Packages)
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e3CD 1
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CDSOT23
CDDFN10-3304NACDDFN10-3304N_part3SMD (Semiconductor Packages)
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e3CD 1
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CDDFN10-3304NA
CDSOT23-TxxLC-Q Seriescdsot23_txxlc_q_part1SMD (Semiconductor Packages)
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e3CD 1
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CDSOT23
CDSOT23-TxxC-Q Seriescdsot23_txxlc_q_part1SMD (Semiconductor Packages)
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e3CD 1
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CDSOT23
CDDFN6-3312Pcddfn6_3312p_part1SMD (Semiconductor Packages)
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e3CD 1
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CDDFN6-3312P
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高速通信ポートの保護PDF843.57 KB28 5, 2015 Download
 
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アスタリスクの付いたフィールドは必須です。
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