RIVERSIDE, Calif., Novmeber 13, 2018 - Bourns, Inc., a leading manufacturer and supplier of electronic components, today announced its new Model TBU-DF and TBU-DB-Q high-speed protector (HSP) device families. These extremely fast (react in <1 millisecond), very precise semiconductor-based protectors provide a simple-to-use data line protection solution that offers inherent coordination with peripheral circuitry and fewer variables that the designer has to consider.
The TBU-DF model is designed to meet the protection needs of RS-485 interfaces that are used for data collection and remote sensing in new IoT, factor and home automation applications and in process control and test and measurement equipment. The AEC-Q101-compliant Model TBU-DB-Q Series matches the protection needs of battery sensing/balancing applications such as those in new battery management systems (BMS).
"Demand for Bourns® TBU® HSPs has grown steadily over the past several years. One of the main reasons is that TBU® devices supply a single protection solution that is simple and straight-forward. Instead of possibly having to select more than one overtemperature and overcurrent solution, a TBU® HSP is able to handle multiple threats – from induced lightning surges and ESD to installation errors and cabling fault issues," said Ben Huang, product line manager for semiconductors at Bourns.
Bourns' new TBU-DF and TBU-DB-Q Series products are low capacitance dual bidirectional high-speed Electronic Current Limiter (ECL) devices offered in surface mount DFN packaging. They are constructed using MOSFET semiconductor technology. When placed in the system circuit, they monitor the current using an integrated detection circuitry that triggers during large voltage or current transient events providing an effective barrier that protects sensitive electronics.
Bourns® TBU-DF and TBU-DB-Q device families are available now, are RoHS compliant* and are IEC 61000, IEC 61000-4-2, IEC 61000-4-4 and IEC 61000-4-5 compliant. As a helpful design resource, Bourns offers an evaluation board allowing developers to easily work with and test the new TBU® HSP products. More detailed product information can be found at:
Bourns® and the Bourns logo are registered trademarks of Bourns, Inc. and may be used only with the permission of Bourns and proper acknowledgement. Other listed names and brands are trademarks or registered trademarks of their respective owners.
* RoHS Directive 2015/863, Mar 31, 2015 and Annex.