Search
Languages

Bourns Announces New ChipGuard® Automotive ESD Protectors

Riverside, Calif., December 17, 2013 - Bourns, Inc., a leading manufacturer and supplier of electronic components, today announced the introduction of new ChipGuard® ESD protectors designed specifically to guard sensitive automotive electronics from the threat of electrostatic discharge (ESD) and are qualified to meet up to IEC 61000-4-2 Level 4 standards. Designated the Bourns® CGA-MLC Series of ESD protectors, these extremely fast bidirectional devices have low capacitance, minimal insertion loss and low leakage over a wide temperature range. The new devices from Bourns are available in ultra-small, industry standard 0402 and 0603 packages. The Bourns ChipGuard® MLC Series of ESD protectors are an ideal protection solution for a large range of automotive applications including antenna circuits, camera links, sensors, touchscreen interfaces, GPS systems, USB 3.0 devices and high-speed communication buses.

"Answering the needs of our automotive customers, Bourns expressly designed our new MLC Series of ESD protectors to deliver the high performance and reliability required for today's sensitive automotive applications," said Kurt Wattelet, Communications Division at Bourns, Inc. "Bourns continually strives to introduce products that our customers need to excel in their respective industries, and this new series of ESD protectors provides the advanced technology needed for the broad spectrum of high speed digital electronics employed in vehicles today."

The Bourns® ChipGuard® MLC Series are fast-response protectors, designed to withstand multi-strike ESD threats, are RoHS* compliant and are fully AEC-Q200 qualified and supported.

Pricing and Availability
The Bourns® CGA-MLC Series of ESD protectors are available now. As a pricing reference, an ESD protector in a 0402 package is priced at $0.08 each in 30,000 piece quantities. For additional product information and specifications, please go to: www.bourns.com/en/docs/product-datasheets/CGA-MLC.pdf.

*RoHs Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.

ボーンズ社について

ボーンズ社(Bourns, Inc.)は、パワーエレクトロニクス、抵抗素子、回路保護部品、およびセンシングソリューションを提供する株式非公開メーカーです。1947年に設立され、米国カリフォルニア州リバーサイドに本社を構え、グローバルな設計・製造・販売ネットワークを通じて、自動車、産業、民生、通信、医療†、オーディオ市場にサービスを提供しています。企業情報および製品情報の詳細は、www.bourns.comをご覧ください。

Bourns®およびBourns のロゴは、Bourns, Inc. の商標または登録商標であり、Bourns の許諾を得た場合のみ公的に使用することができ、また適切な権利の表記が必要です。 列挙した他の名称およびブランドは、各権利所有者の商標または登録商標です。

† Bourns®製品は、命を救うため、または生命を維持するためのアプリケーションや、Bourns®製品の故障または誤動作による人身傷害、または死亡につながる可能性のある、その他のアプリケーション向けに設計されていません。免責事項のお知らせをご参照ください。www.bourns.com/docs/legal/disclaimer.pdf

メディアエージェンシー窓口:
Annette Keller
Keller Communication
(949) 947-7232
annettekeller1984@gmail.com
弊社窓口:
Josephine Chen
Bourns Asia Pacific, Inc.
886-2-2562-4117 #138
Josephine.chen@bourns.com