Bourns - Hochgeschwindigkeitsschutz TBU-

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Max Impulse Voltage Vimp (V)

Max continuous RMS AC voltage (Vrms)

Min Trigger Current (mA)

Typ Trigger Current (mA)

Typ On Resistance (Ω)

PART NUMBER	Max Impulse Voltage Vimp (V)	Max continuous RMS AC voltage (Vrms)	Min Trigger Current (mA)	Typ Trigger Current (mA)	Typ On Resistance (Ω)	Response Time (ns)	Device Type	Package Type	Engineering	Buy Now

PART NUMBER

Max Impulse Voltage Vimp (V)

Max continuous RMS AC voltage (Vrms)

Min Trigger Current (mA)

Typ Trigger Current (mA)

Typ On Resistance (Ω)

Response Time (ns)

Device Type

Package Type

Engineering

Buy Now

Model/Datasheet	MSL	Lötprofile	Verpackungsetikett	Anschluss	Konf.	Prüfberichte Dritter	MDB	China RoHS
TBU-CA	1	SMD (Semiconductor Packages)	Label TBU	e3	TBU1	Request Report	TBU-CA	China RoHS2 - TBU
TBU-DB-Q	1	SMD (Semiconductor Packages)	Label TBU	e3	TBU1	Request Report	TBU-DB-Q	China RoHS2 - TBU
TBU-CA-Q	1	SMD (Semiconductor Packages)	Label TBU	e3	TBU1	Request Report	TBU-CA	China RoHS2 - TBU
TBU-DF	1	SMD (Semiconductor Packages)	Label TBU	e3	TBU1	Request Report	TBU-DF	China RoHS2 - TBU
TBU-DT	1	SMD (Semiconductor Packages)	Label TBU	e3	TBU1	Request Report	TBU-DT	China RoHS2 - TBU
TBU-PL	1	SMD (Semiconductor Packages)	Label TBU	e3	TBU1	Request Report	TBU-PL	China RoHS2 - TBU
TBU-RS	1	See Data Sheet	Label TBU	e3	TBU1	Request Report	TBU-RS	China RoHS2 - TBU
P40	1	SMD (Semiconductor Packages)	Label TBU	e3	TBU1	Request Report	TBU-P40	China RoHS2 - TBU
P-G	3	SMD (Semiconductor Packages)	Label TBU	e3	TBU1	Request Report	TBU-Pxxx	China RoHS2 - TBU
C	3	SMD (Semiconductor Packages)	Label TBU	e3	TBU1	Request Report	TBU-Cxxx	China RoHS2 - TBU